Vertical Continuous Plating Line (MCP-PAL)

In response to the increasingly stringent requirements in both advanced technology and product variety, PAL formed an association in early 2002 with a well-known electroplating equipment manufacturer in Japan, Marunaka Kogyo Co Ltd, to futher develop and promote its Vertical Continuous Plating Equipment ( MCP-PAL ). Marunaka has obtained several patents in this MCP-PAL equitment. In the past four years ( up to end of 2003 ), over 50 machines of this type have been supplied to major customer in Japan, China, Taiwan and Korea, ect.

Through continuous research, development and enhancement work of PAL engineers, MCP-PAL offers excellent design features, high quality plating performance and outstanding reliability. Looking to the future, PAL will continue to strive to enhance and expand the capabilities of the vertical continuous plating concept to ensure maximum satisfaction of customers from various industries.

Standard Specifications :

	Effective Plating Length	13.5m
	Machine Dimensions (including Side Equipment)	17m(L) x 5m(W) x 3.2m(H)
	Machine Cycle (minimum)	35 seconds
	Panel Thickness (minimum)	0.06mm
	Panel Thickness (maximum)	3.2mm (with standard racking)
	Panel Size (minimum)	342mm x 406mm
	Panel size (maximum)	508mm x 610mm
	Standard Plating Thickness	20 micron
	Standard Plating Density	2.5 A / dm²
	Output (maximum)	330 ft² / hour
	Process	Panel, Pattern
	Distance between Panels	Below 10mm

Through Hole Plating	Via Filling	Blind Via Filling
Ø=0.3mm   A/R=1:12  T/P=82%	Ø=100μm   A/R=1:0.75   Fill-up Ratio=95%	Ø=75μm   A/R=1:0.5   T/P=92%

Panel Plating Distribution

Panel Size (W x H) (t = panel thickness)	CoV Coefficient of Variance	σ (mil) Standard Deviation	3 σ / x bar Distribution	R (mil) Range
16 " x 20" (t = 1mm)	4%	0.034	4.4%	0.13
22" x 20" (t = 0.2mm)	4%	0.038	5.1%	0.15
20" x 24" (t = 1mm)	5%	0.050	6.3%	0.21

Remarks: Excluding 12mm panel edge

Two Type of Distribution: